Accurate Analytical Switching Loss Model for High Voltage SiC MOSFETs Includes Parasitics and Body Diode Reverse Recovery Effects

Soheila Eskandari, Kang Peng, Bo Tian, E. Santi
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引用次数: 8

Abstract

In the quest for higher power density in switching converters, the use of SiC MOSFETs provides increased switching speed, which allows higher switching frequencies and smaller filtering elements. In order to accurately estimate switching losses in these fast high-voltage devices, a detailed analytical loss model considering parasitic effects and parasitic elements is required. In this paper, a simple and accurate analytical loss model is presented which considers the device junction capacitances, parasitic inductances and reverse recovery of the high voltage SiC MOSFET body diode. The reverse recovery time is calculated and used in the model. The proposed model provides easy-to-use closed-form mathematical equations and gives insight into the switching process and the parameters that affect it. Analytical equations are validated by experimental results.
高电压SiC mosfet的精确解析开关损耗模型包括寄生效应和体二极管反向恢复效应
为了在开关转换器中追求更高的功率密度,使用SiC mosfet提供了更高的开关速度,从而允许更高的开关频率和更小的滤波元件。为了准确估计这些快速高压器件的开关损耗,需要一个详细的考虑寄生效应和寄生元件的分析损耗模型。本文在考虑器件结电容、寄生电感和高压SiC MOSFET体二极管反向恢复等因素的基础上,提出了一种简单、准确的分析损耗模型。计算了反向恢复时间,并将其用于模型中。所提出的模型提供了易于使用的封闭形式的数学方程,并提供了深入了解开关过程和影响它的参数。实验结果验证了解析方程的正确性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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