A Microcontroller-based Electrochemical Discharge Machining (ECDM) Equipment for Micro-drilling of Quartz Substrates

S. Saranya, Adepu Ravi Sankar
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引用次数: 3

Abstract

Electrochemical discharge machining (ECDM) is a hybrid micromachining technique used for micro-structuring quartz substrates. In the present work, we have built a microcontroller based ECDM setup for drilling quartz substrates. This setup can be effectively used to fabricate precise micro-holes using the constant velocity feed drilling technique. The tool can be moved along the Z-axis with the minimum and maximum speeds of 1 $mm/hr$ and 50 $mm/hr$ respectively. In order to study the effect of tool feed rate (TFR) on precision improvement, micro-holes were fabricated at different tool feed rates ranging from 0.3 $\mu m/\sec$ to 1.7 $\mu m/sec$. The optimum TFR for fabricating micro-holes with the least entrance diameter, central diameter and overcut was observed to be 0.8 $\mu m/sec$. The lower TFR values $(\lt 0.8\mu m/\sec)$ can be used for fabricating through-holes on the substrates. A through-hole having with an aspect ratio of 2.32 with entrance and exit diameters of 820 $\mu m$ and 677 $\mu m$ respectively was fabricated at a TFR of 0.6 $\mu m/sec$.
基于单片机的石英基微孔电化学放电加工(ECDM)设备
电化学放电加工(ECDM)是一种用于石英衬底微结构加工的混合微加工技术。在目前的工作中,我们建立了一个基于微控制器的ECDM设置,用于钻取石英衬底。该装置可有效地用于恒速进给钻孔技术加工精密微孔。该工具可以沿z轴移动,最小和最大速度分别为1 $mm/hr和50 $mm/hr。为了研究刀具进给速度(TFR)对精度提高的影响,在0.3 $\mu m/\sec$ ~ 1.7 $\mu m/sec$的进给速度下加工微孔。制备入口直径、中心直径和过切最小微孔的最佳TFR为0.8 μ m/sec。较低的TFR值$(\lt 0.8\mu m/\sec)$可用于在基板上制造通孔。在TFR为0.6 $\mu m/sec$的条件下,制备了长径比为2.32,进出口直径分别为820 $\mu m$和677 $\mu m$的通孔。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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