Thermal Flattening in 3D FPGAs Using Embedded Cooling (Abstract Only)

Abstract

Thermal management is one of the key concerns in modern high power density chips. A variety of thermal cooling techniques that have been in use in industrial applications are now also being applied to integrated circuits. In this work, we explore the integration of thermal aware CAD techniques with embedded cooling solutions to achieve smoother thermal profiles in 3D FPGAs. We also present some results on coolant temperatures and flow rates and their effect on thermal gradients on the chip.