Impact of Gamma irradiation on advanced Si/SiGe:C BiCMOS technology: comparison versus X-ray

J. El Beyrouthy, B. Sagnes, F. Pascal, M. Elsherif, J. Boch, T. Maraine, S. Haendler, P. Chevalier, D. Gloria
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Abstract

Gamma irradiation effects are investigated on Si/SiGe:C HBTs developed with the latest BiCMOS technologies. Unbiased HBTs are irradiated with a Co60source until in a Total Ionizing Dose of 330 krad. Irradiation effects are evaluated by measuring the excess base current from DC characteristics (Gummel plot) and the base current spectral density from Low Frequency Noise measurements, mainly by analyzing the 1/f noise level. Degradation comparison on two advanced BiCMOS technologies is done. The recent generation of the technology presents the highest robustness. Moreover, a comparison of the degradation induced by the Gamma source with an earlier study using an X-ray source is held.
伽马辐照对先进Si/SiGe:C BiCMOS技术的影响:与x射线的比较
研究了伽玛辐射对采用最新BiCMOS技术制备的Si/SiGe:C hbt的影响。无偏置HBTs用co60源照射,直到总电离剂量为330克拉。通过测量直流特性的过量基极电流(Gummel图)和低频噪声测量的基极电流谱密度来评估辐照效应,主要是通过分析1/f噪声水平。对两种先进的BiCMOS技术进行了降解比较。最新一代的技术表现出最高的鲁棒性。此外,还将伽玛源引起的退化与早先使用x射线源的研究进行了比较。
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