A 15.9 mW 96.5 fps Memory-Efficient 3D Reconstruction Processor with Dilation-based TSDF Fusion and Block-Projection Cache System

Hankyul Kwon, Gwangtae Park, Junha Ryu, Wooyoung Jo, H. Yoo
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Abstract

A real-time dense 3D reconstruction on lightweight AR headsets is challenging since its memory access surpasses the available memory bandwidth. To solve this problem, the proposed processor integrates two key building blocks - Dilation-based TSDF (D-TSDF) fusion and Block-Projection (BP) engine. D-TSDF projects the depth map in the reverse order of voxel-to-pixel coordinate transformation and dilates it, leading to 96.61% External Memory Access (EMA) reduction with minimum map quality degradation. Second, a specialized BP engine compresses high-resolution occupancy grid by decomposing the 3D bitmap into 2D and 1D vectors, achieving $\times \mathbf{166.09}$ reduced memory bandwidth. The proposed processor is implemented in 28nm CMOS technology occupying 1.27 mm2 area. As a result, 96.45 fps 3D reconstruction is possible while consuming only 15.94 mW power.
基于膨胀的TSDF融合和块投影缓存系统的15.9 mW 96.5 fps高效内存3D重建处理器
轻量级AR头显上的实时密集3D重建具有挑战性,因为它的内存访问超过了可用的内存带宽。为了解决这一问题,该处理器集成了两个关键的构建模块-基于膨胀的TSDF (D-TSDF)融合和块投影(BP)引擎。D-TSDF将深度图按体素到像素坐标变换的相反顺序投影并进行扩展,在最小的地图质量下降的情况下,减少了96.61%的外部内存访问(EMA)。其次,专门的BP引擎通过将3D位图分解为2D和1D向量来压缩高分辨率占用网格,从而减少了$\times \mathbf{166.09}$的内存带宽。该处理器采用28nm CMOS技术,占地1.27 mm2。因此,在仅消耗15.94 mW功率的情况下,可以实现96.45 fps的3D重建。
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