Analyzing power MOSFET breakdown voltage using simulators

M. Chrzanowska-Jeske
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Abstract

A comprehensive analysis of the performance of the power MOSFET using process and device simulators is described. The power MOSFET process is simulated using TSUPREM and the simulated profile is used as an input to MEDICI to simulate the device performance. The dependence of the breakdown voltage on the device parameters, epi-layer thickness and doping concentration, and the parameter variations are used to establish the values of design parameters for the target breakdown voltage and desired yield.
利用模拟器分析功率MOSFET击穿电压
利用过程和器件模拟器对功率MOSFET的性能进行了全面分析。利用TSUPREM对功率MOSFET过程进行模拟,并将模拟的轮廓作为MEDICI的输入来模拟器件性能。击穿电压与器件参数、外延层厚度和掺杂浓度的关系,以及参数的变化,被用来建立目标击穿电压和期望良率的设计参数值。
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