Finite Element Analysis of Stress Distributions in Interconnect Structures

Abstract

Finite element analysis has been used to study the influences of different inter metal dielectric materials, via plug-fill technologies and material properties on the thermal-mechanical stresses in a two level interconnect structure. Results indicate the presence of large stresses and stress gradients at metal interfaces which could lead to delamination failures and have a detrimental effect on the electromigration performance of an interconnect system.