E. Sicard, S. Delmas, F. Caignet, R. De Smedt, T. Steinecke, J. Ferrante, P. Saintot
{"title":"A cooperative research for experimental characterization of signal integrity in deep submicron integrated circuits","authors":"E. Sicard, S. Delmas, F. Caignet, R. De Smedt, T. Steinecke, J. Ferrante, P. Saintot","doi":"10.1109/ISEMC.1999.812928","DOIUrl":null,"url":null,"abstract":"The following paper describes a cooperative project between four major European industries and one academic institute, on the development of a novel measurement method for the precise characterization of signal integrity. The method has been implemented in 0.35, 0.25 and 0.18 /spl mu/m CMOS technology, and several aspects of signal integrity have been investigated: interconnect delay, crosstalk within interconnects, delay induced by crosstalk and power supply lines fluctuations. Details on the method and the milestones of the project are reported in the paper.","PeriodicalId":312828,"journal":{"name":"1999 IEEE International Symposium on Electromagnetic Compatability. Symposium Record (Cat. No.99CH36261)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"1999-08-02","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"6","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"1999 IEEE International Symposium on Electromagnetic Compatability. Symposium Record (Cat. No.99CH36261)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ISEMC.1999.812928","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 6
Abstract
The following paper describes a cooperative project between four major European industries and one academic institute, on the development of a novel measurement method for the precise characterization of signal integrity. The method has been implemented in 0.35, 0.25 and 0.18 /spl mu/m CMOS technology, and several aspects of signal integrity have been investigated: interconnect delay, crosstalk within interconnects, delay induced by crosstalk and power supply lines fluctuations. Details on the method and the milestones of the project are reported in the paper.