Multi-objective optimization of fin array heat sinks

K. Lampio, R. Karvinen
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引用次数: 1

Abstract

A method is presented to determine the temperature field of an electronics cooling heat sink. The method is based on calculation of heat conduction in a solid numerically with the finite volume method and on solving fluid convection from analytical equations. The model is suitable for forced and natural convection heat sinks, and it uses solutions of a parallel plate channel for the friction factor and the convection Nusselt number. The validity of the method is verified by comparing its results to measured data and to CFD calculations. After verification, two practical multi-objective optimization examples are given. The first one, an industrial application, is a forced convection heat sink composed of nine heat generating components at the base plate. Then, natural convection optimization is performed on a reference array with two components. In both cases, mass is minimized, the other criterion being the maximum temperature for forced convection case, and the heat sink outer volume for natural convection case.
翅片阵列散热器的多目标优化
提出了一种确定电子冷却散热器温度场的方法。该方法基于用有限体积法数值计算固体热传导和用解析方程求解流体对流。该模型适用于强迫对流和自然对流散热器,并使用平行板通道的解来计算摩擦因子和对流努塞尔数。通过与实测数据和CFD计算结果的比较,验证了该方法的有效性。经过验证,给出了两个实际的多目标优化实例。第一个是工业应用,是一个强制对流散热器,由底板上的九个发热部件组成。然后,对包含两个分量的参考阵列进行自然对流优化。在这两种情况下,质量都是最小的,另一个标准是强迫对流情况下的最高温度,以及自然对流情况下的散热器外积。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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