Integration and Electrical Evaluation of Epitaxially Grown Si and SiGe Channels for Vertical NAND Memory Applications

E. Capogreco, R. Degraeve, J. Lisoni, V. Luong, A. Arreghini, M. Toledano-Luque, A. Hikavyy, T. Numata, K. De Meyer, G. Van den bosch, J. van Houdt
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引用次数: 9

Abstract

Epitaxially grown Si and Si0.6Ge0.4 are integrated as replacement of poly-Si channel in vertical cylindrical transistors for vertical NAND memory application, in order to investigate the impact of the grain boundaries on current conduction. Epi-Si outperforms both poly-Si and Epi-SiGe channels, resulting in the best conduction, with large improvement on both sub threshold swing and transconductance (gm). The experimentally observed gm bimodal distribution for epi Si is corroborated and explained through a resistive network model: lower gm conduction occurs when current needs to cross a high resistance boundary, whereas higher gm is obtained when this boundary is not present.
垂直NAND存储器外延生长Si和SiGe通道的集成和电学评价
为了研究晶界对电流传导的影响,将外延生长的Si和Si0.6Ge0.4集成到垂直圆柱形晶体管中,以替代多晶硅沟道用于垂直NAND存储器。Epi-Si通道优于多晶硅和Epi-SiGe通道,具有最佳导电性,在亚阈值摆动和跨导(gm)方面都有很大改善。通过电阻网络模型证实并解释了实验观察到的epi Si的gm双峰分布:当电流需要穿过高电阻边界时,会发生较低的gm导通,而当该边界不存在时,则会获得较高的gm导通。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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