Fabrication and optimization of T -gate for high performance HEMT and MMIC devices

Aneesh M. Joseph
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Abstract

The design of T -Gate is crucial for the performance of AlGaN/GaN power amplifiers. Optimizing aT-gate reproducibly is a challenge on Gallium Nitride (GaN) on Silicon Carbide (SiC) due to the charging of the substrate. Single-step electron-beam lithography (EBL) has been demonstrated by engineering by dose and photoresist parameters.
用于高性能HEMT和MMIC器件的T栅极的制造和优化
T栅极的设计对AlGaN/GaN功率放大器的性能至关重要。由于衬底的充电性,氮化镓(GaN)在碳化硅(SiC)上优化at栅极的可重复性是一个挑战。单步电子束光刻(EBL)已通过剂量和光抗蚀剂参数进行了工程验证。
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