Status and trends in power semiconductor devices

Proceedings of IECON '93 - 19th Annual Conference of IEEE Industrial Electronics Pub Date : 1993-11-15 DOI:10.1109/IECON.1993.339117

D. Blackburn

引用次数: 2

Abstract

A brief description of some developments that affect the application of power semiconductor devices is given. Developments in 'chips', packages, simulation, and new materials are included.<>

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功率半导体器件的现状与趋势

简要介绍了影响功率半导体器件应用的一些发展。包括“芯片”、封装、仿真和新材料的发展

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

Proceedings of IECON '93 - 19th Annual Conference of IEEE Industrial Electronics

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