{"title":"Electrical interfaces compatibility analysis for the COMS EPS","authors":"J. Koo, Eui-Chan Kim","doi":"10.1109/ICPE.2007.4692402","DOIUrl":null,"url":null,"abstract":"The COMS (communication, ocean and meteorological satellite) EPS (electrical power subsystem) is derived from an enhanced Eurostar 3000. The COMS EPS can offer a bus power capability of 3 kW. The aim of this analysis is to verify the electrical compatibility of the interfaces which exist between COMS EPS equipments and external equipments. For each interface, this study checked the compatibility between equipments for the power links, commands, digital telemetry, analog telemetry and failure condition. In addition with this interface compatibility verification, this study outputs electrical and manufacturing constraints to be applied at harness level.","PeriodicalId":227237,"journal":{"name":"2007 7th Internatonal Conference on Power Electronics","volume":"11 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2007-10-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2007 7th Internatonal Conference on Power Electronics","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/ICPE.2007.4692402","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
The COMS (communication, ocean and meteorological satellite) EPS (electrical power subsystem) is derived from an enhanced Eurostar 3000. The COMS EPS can offer a bus power capability of 3 kW. The aim of this analysis is to verify the electrical compatibility of the interfaces which exist between COMS EPS equipments and external equipments. For each interface, this study checked the compatibility between equipments for the power links, commands, digital telemetry, analog telemetry and failure condition. In addition with this interface compatibility verification, this study outputs electrical and manufacturing constraints to be applied at harness level.