Laminate package trends for high-speed system interconnects

Abstract

As the performance of processors and their associated supporting components increases with improvements in process technologies, the demand on packaging solutions is also increasing. High-speed devices require complex thermal, power delivery and signal integrity solutions at relatively low cost to be competitive in the present marketplace. This paper presents the rapidly evolving laminate package trends and advances for high-speed system-level interconnects. The importance of properly designing the substrate for high-speed signaling is discussed including identification of key parameters and design tradeoffs.