Characteristics of Glass-Embedded FOAiP with Antenna Arrays for 60GHz mmWave Applications

2022 IEEE 72nd Electronic Components and Technology Conference (ECTC) Pub Date : 2022-05-01 DOI:10.1109/ectc51906.2022.00066

I-Hung Lin, Cheng-Chen Lin, Ying-Chieh Pan, B. Lwo, Tom Ni

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Abstract

This paper first presents the architecture of a self-designed, slot-coupled patch antenna unit in a glass-embedded fan-out antenna in package. Due to the embedded glass, design flexible and the radiation properties of the antenna structure was improved by single or double-sided patch made by redistribution layers (RDLs) on the embedded glass surfaces. The FOAiP is an extended application of fan-out technology in the advanced electronics package. It provides an ideal approach for millimeter-wave (mmWave) chip with low transmission loss of chip-to-antenna interconnect and greater design flexibilities. However, mmWave signals from a single antenna cannot be concentrated over a long distance because of its limited transmission power. Therefore, an antenna array was explored to enhance the antenna gain and the transmission distance in this study, and the full wave 3D electromagnetic (EM) simulation software (ANSYS HFSS) was employed to simulate the antenna characteristics of the FOAiP with varying structural designs and the characteristics of the array antenna with various array forms. In the slot-coupled antenna structure, the microstrip and the grounding coplanar waveguide (CPW) layer are located at RDL-1 (the feeding interconnection) and RDL-2 (beneath the glass), respectively, and the reflector layer is located on the PCB surface. As a result, a single antenna model was optimized with center frequency of 60 GHz with 5.5db gain and the bandwidth was 3.89 GHz. With the optimized antenna unit, the simulation results on antenna arrays revealed that the radiation field patterns were efficiently concentrated and the gains were increased with the array size, but the antenna bandwidths were slightly different. Furthermore, the four-by-four array antenna exhibited gain increased by 3.2 times than a single antenna. That is, the optimal characteristics of the antenna array had 59.83 GHz center frequency, 17.6 dB gain, and its bandwidth was 4.1 GHz.

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60GHz毫米波应用中带有天线阵列的玻璃嵌入式FOAiP特性

本文首先介绍了一种自行设计的槽耦合贴片天线单元的结构，该单元采用玻璃内嵌式扇出天线封装。由于内嵌玻璃的存在，在内嵌玻璃表面通过重分布层(rls)制作单面或双面贴片，提高了天线结构的设计灵活性和辐射性能。FOAiP是扇出技术在先进电子封装中的扩展应用。它为毫米波(mmWave)芯片提供了一种理想的方法，具有芯片到天线互连的低传输损耗和更大的设计灵活性。然而，由于其有限的传输功率，来自单个天线的毫米波信号无法远距离集中。因此，本研究探索了一种提高天线增益和传输距离的天线阵列，并利用全波三维电磁仿真软件ANSYS HFSS对FOAiP不同结构设计的天线特性和不同阵型的阵列天线特性进行了仿真。在槽耦合天线结构中，微带层和接地共面波导(CPW)层分别位于RDL-1(馈电互连)和RDL-2(玻璃下方)，反射层位于PCB表面。结果表明，优化后的单天线模型中心频率为60 GHz，增益为5.5db，带宽为3.89 GHz。优化后的天线单元在天线阵列上的仿真结果表明，随着阵列尺寸的增大，辐射场方向图有效集中，增益增大，但天线带宽略有不同。此外，4 × 4阵列天线的增益比单个天线增加了3.2倍。即天线阵的最优特性为中心频率59.83 GHz，增益17.6 dB，带宽4.1 GHz。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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2022 IEEE 72nd Electronic Components and Technology Conference (ECTC)

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