Tayeb Bouhadiba, M. Moy, F. Maraninchi, J. Cornet, L. Maillet-Contoz, Ilija Materic
{"title":"Co-simulation of Functional SystemC TLM Models with Power/Thermal Solvers","authors":"Tayeb Bouhadiba, M. Moy, F. Maraninchi, J. Cornet, L. Maillet-Contoz, Ilija Materic","doi":"10.1109/IPDPSW.2013.206","DOIUrl":null,"url":null,"abstract":"Modern systems-on-chips need sophisticated power-Management policies to control their power consumption and temperature. These power-management policies are usually implemented partly in software, with hardware support. They need to be validated early, hence power and temperature-aware simulation techniques at the system-level need to be developed. Existing approaches for system-level power and thermal analysis usually either completely abstract the functionality (allowing only simple scenarios to be simulated), or run the functional simulation independently from the non-functional one. The approach presented in this paper allows a coupled simulation of a SystemC/TLM model, possibly including the actual embedded software, with a power and temperature solver such as ATMI or the commercial tool ACEplorer. Power and temperature analysis is done based on the stimuli sent by the SystemC/TLM platform, which in turn can take decisions based on the non-functional simulation.","PeriodicalId":234552,"journal":{"name":"2013 IEEE International Symposium on Parallel & Distributed Processing, Workshops and Phd Forum","volume":"1 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-05-20","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"17","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2013 IEEE International Symposium on Parallel & Distributed Processing, Workshops and Phd Forum","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/IPDPSW.2013.206","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 17
Abstract
Modern systems-on-chips need sophisticated power-Management policies to control their power consumption and temperature. These power-management policies are usually implemented partly in software, with hardware support. They need to be validated early, hence power and temperature-aware simulation techniques at the system-level need to be developed. Existing approaches for system-level power and thermal analysis usually either completely abstract the functionality (allowing only simple scenarios to be simulated), or run the functional simulation independently from the non-functional one. The approach presented in this paper allows a coupled simulation of a SystemC/TLM model, possibly including the actual embedded software, with a power and temperature solver such as ATMI or the commercial tool ACEplorer. Power and temperature analysis is done based on the stimuli sent by the SystemC/TLM platform, which in turn can take decisions based on the non-functional simulation.