Circuit boards with integrated optical interconnects-technology, modeling, and application examples

E. Strake, D. Krabe
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引用次数: 1

Abstract

This contribution presents concepts, technologies, and first results for novel hybrid electrical/optical circuit boards which extend the conventional setup of existing electrical printed circuit boards by incorporating additional layers with optical waveguide structures. A major aspect of the inclusion of optically functional layers into conventional circuit boards is the requirement of maximum compatibility with existing board fabrication and assembly techniques. Any substantial change in board fabrication and assembly parameters has to be avoided in order to obtain the desired cost efficiency.
集成光互连电路板-技术,建模和应用实例
本文介绍了新型混合电/光电路板的概念、技术和初步结果,该电路板通过结合光波导结构的附加层扩展了现有电子印刷电路板的传统设置。将光学功能层纳入传统电路板的一个主要方面是要求与现有电路板制造和组装技术最大程度地兼容。为了获得理想的成本效率,必须避免电路板制造和组装参数的任何实质性变化。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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