The RF Characteristics of the RF MEMS Switch as the Substrate Resistivity

S. Kang, S. Park, H.C. Kim, K. Chun
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引用次数: 3

Abstract

This paper presents the RF characteristics of the RF MEMS switch as the silicon substrate resistivity. The larger the resistivity of silicon substrate is, the larger the insertion loss of the RF MEMS switch is. When the RF MEMS switch is fabricated with the single crystalline silicon, the RF characteristics are changed by resistivity of silicon. It is necessary to study the change of RF characteristics as the substrate resistivity. The RF characteristics were simulated with different resistivity of silicon substrate. The RF MEMS switches were fabricated on each substrate with different resistivity. The RF MEMS switch was fabricated with the resistivity of 10 ohm-cm, the insertion loss of that is about 0.2 dB at 6 GHz. And the RF MEMS switch was fabricated with the resistivity of 500 Ohm-cm, the insertion loss of that is about 0.6 dB at 6 GHz.
射频MEMS开关的射频特性随衬底电阻率的变化
本文介绍了射频MEMS开关的射频特性,即硅衬底电阻率。硅衬底电阻率越大,射频MEMS开关的插入损耗越大。用单晶硅制作射频MEMS开关时,硅的电阻率会改变开关的射频特性。有必要研究射频特性随衬底电阻率的变化。模拟了不同硅衬底电阻率下的射频特性。在不同电阻率的衬底上制作射频MEMS开关。该射频MEMS开关的电阻率为10 ω -cm,在6 GHz时的插入损耗约为0.2 dB。制作了电阻率为500欧姆-cm的射频MEMS开关,该开关在6 GHz时的插入损耗约为0.6 dB。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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