{"title":"Functional SU-8-PET composite microchip including Au microdot array fabricated by low temperature polymer bonding","authors":"R. Yamamoto, K. Sueyoshi, K. Otsuka","doi":"10.1109/NEMS.2013.6559762","DOIUrl":null,"url":null,"abstract":"Au deposited SU-8 microdots comprised SU-8-PET microchip using low temperature polymer bonding technology is developed. A fine microdot array (1μm×1μm×0.5μm dots with 2μm pitch in area of 50μm×5mm) is fabricated by electron beam lithography (EBL) using SU-8 as a negative tone resist. A microchannel structure is formed with UV patterned SU-8 on a glass substrate. The SU-8 structure is sealed with a PET film by low temperature silane coupling bonding (140<sup>o</sup>C, 1.5MPa, 5min). The proposed microchip is fabricated successfully without leakage and is applicable as a microchip electrophoresis.","PeriodicalId":308928,"journal":{"name":"The 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems","volume":"19 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2013-04-07","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"The 8th Annual IEEE International Conference on Nano/Micro Engineered and Molecular Systems","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/NEMS.2013.6559762","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
Au deposited SU-8 microdots comprised SU-8-PET microchip using low temperature polymer bonding technology is developed. A fine microdot array (1μm×1μm×0.5μm dots with 2μm pitch in area of 50μm×5mm) is fabricated by electron beam lithography (EBL) using SU-8 as a negative tone resist. A microchannel structure is formed with UV patterned SU-8 on a glass substrate. The SU-8 structure is sealed with a PET film by low temperature silane coupling bonding (140oC, 1.5MPa, 5min). The proposed microchip is fabricated successfully without leakage and is applicable as a microchip electrophoresis.