Monolithic InGaAs/InGaAsP electro-absorption intensity modulator fabricated using low energy arsenic ion implantation induced intermixing

S. L. Ng, H.S. Lim, B. Ooi, Y. Lam, Y. Zhou, Y. Chan, V. Aimez, J. Beauvais, J. Beerens
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Abstract

10-channel monolithic multiple wavelength electro-absorption (EA) modulators have been fabricated onto a single chip using a one-step quantum well intermixing technique based on As/sup 2+/ ion implantation through a graded thickness silicon dioxide mask. Each individual modulator has a dimension of 400/spl times/500 /spl mu/m/sup 2/, 50 /spl mu/m width of active window, 500 /spl mu/m cavity length and 20 /spl mu/m width of isolation trench. The EA intensity modulators were characterized at room temperature using end-fire-coupling technique. Samples used in this study had a InGaAs/InGaAsP MQW (five quantum wells) laser structure grown by metal-organic vapor phase epitaxy and were of the form of a stepped graded index heterostructure.
低能砷离子注入诱导混合制备InGaAs/InGaAsP单片电吸收强度调制器
采用基于As/sup +/离子注入的一步量子阱混合技术,通过渐变厚度的二氧化硅掩膜将10通道单片多波长电吸收(EA)调制器制作到单芯片上。每个单独的调制器的尺寸为400/spl倍/500 /spl亩/米/sup 2/,活动窗宽度为50 /spl亩/米,空腔长度为500 /spl亩/米,隔离沟宽度为20 /spl亩/米。利用端火耦合技术在室温下对EA强度调制器进行了表征。本研究样品采用金属-有机气相外延生长的InGaAs/InGaAsP MQW(五量子阱)激光结构,为阶梯渐变指数异质结构。
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