SmartFoil: a Novel Assembly Technology for Electronic Circuit Boards in Multifunctional Units

2018 IEEE International Conference on Electrical Engineering and Photonics (EExPolytech) Pub Date : 2018-10-01 DOI:10.1109/EEXPOLYTECH.2018.8564437

O. Kvashenkina, P. Gabdullin, A. V. Arkhipov

引用次数: 4

Abstract

The paper presents a new original technology for fast assembly of electronic boards, named SmartFoil. Basic operation principles are described. SmartFoil is compared with the most widely used present techniques of assembly of microwave units, such as furnace soldering, wave soldering, manual or automated tinning.

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智能箔:一种用于多功能电子电路板的新型组装技术

本文提出了一种新颖的电子电路板快速组装技术——SmartFoil。介绍了基本的工作原理。SmartFoil与目前最广泛使用的微波单元组装技术进行比较，例如炉焊，波峰焊，手动或自动镀锡。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

2018 IEEE International Conference on Electrical Engineering and Photonics (EExPolytech)

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