Investigations on Half-Mode Substrate Integrated Waveguide for High-Speed Interconnect Application

Abstract

The investigations on half-mode substrate integrated waveguide (HMSIW) optimized for use in high-speed bandpass digital interconnects is reported in this paper. It is known that the substrate integrated waveguide (SIW) has been successfully proposed and used in ultrahigh-speed digital interconnects. The structure features low-loss, low-crosstalk and easy-to-fabricate in planar form using a standard printed circuit board (PCB) process. The novelty of implementing HMSIW in the case of interconnects is that it can reduce the SIW transverse width by nearly 50%, and has a much wider bandwidth than that of SIW. The HMSIW structure exhibits low loss and leakage when tested at tens of GHz frequency range. Moreover, the near-end and the far-end cross-talks of HMSIW in dense layout are shown to have a better performance than those of microstrip line. HMSIW also can be easily bended to adapt different layout.