Suppression of power/ground noise using meshed-planar electromagnetic bandgap (MP-EBG) structure for Ultra-Wideband (UWB) System-in-Package (SiP)

Myunghoi Kim, C. Yoon, Kyoungchoul Koo, C. Hwang, Hajin Sung, Joungho Kim
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引用次数: 5

Abstract

In this paper, we propose the meshed-planar electromagnetic bandgap (MP-EBG) structure with a meshed planar surface embedded in the package power plane to suppress a power/ground noise in the frequency range from 3.1GHz to 10.6GHz, also known as the frequency band of Ultra-Wideband (UWB). The MP-EBG structure has two different EBG surfaces. One surface is a mushroom-like surface embedded between a package power and a ground plane and the other surface is a meshed planar structure embedded in a package power plane. The MP-EBG structure enables to enhance the bandwidth of the stopband in the limited package area and achieve the 8.7GHz stop bandwidth with −30dB isolation.
利用平面网格电磁带隙(MP-EBG)结构抑制超宽带(UWB)系统级封装(SiP)电源/地噪声
在本文中,我们提出了一种网格平面电磁带隙(MP-EBG)结构,该结构将网格平面嵌入封装电源平面,以抑制3.1GHz至10.6GHz频率范围内的电源/地噪声,也称为超宽带(UWB)频段。MP-EBG结构有两个不同的EBG表面。一个表面是嵌入在封装电源和接平面之间的蘑菇状表面,另一个表面是嵌入在封装电源平面中的网格平面结构。MP-EBG结构能够在有限的封装面积内增强阻带带宽,并在隔离度为- 30dB的情况下实现8.7GHz的阻带带宽。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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