Novel PCB fabrication process roughness free for high frequency applications.

Abstract

In this work, a new process for Print Circuit Board (PCB) fabrication is introduced. It is so far one of the lowest losses PCB fabrication process, for high frequency operation. Instead of a rigged surface for adhesion of the metal, a plasma process is used on homogeneous and polished surface of Teflon as substrate. For demonstrating the capability of this proposal, a microstrip is built and resulted with attenuation of a 2 Np/m at 20 GHz, loses were obtained from measurements from S-parameters.