Design and simulation of metamaterials using star shape fractal antenna

2017 2nd IEEE International Conference on Recent Trends in Electronics, Information & Communication Technology (RTEICT) Pub Date : 2017-05-01 DOI:10.1109/RTEICT.2017.8256655

A. Singh, Malkeet Singh, Bhavesh, Devesh Kumar, Sumit Bhardwaj

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引用次数: 3

Abstract

In this paper, a simple metamaterial based compact microstrip antenna is presented for UWB applications. A patch of dimension 36 ×36 mm is being selected. The resonant frequency of patch antenna is minimized by zero iteration is fixed to out from its patch radiating at its center respectively. And we will compare with second iteration positively. In this particular design, dimensions of the star length was varied & the antenna is being operated at 3.45GHz using the software HFSS. On the other hand for making star shape cut in ground give 0.3mm star shape antenna. Another ground is designed with 2mm gap to metamaterial. Dimension of ground is 20.6 × 31.6. The substrate material used in our work is FR4. The dimension of substrate is 45.4 × 31.6 × 1.6 mm. The ground part is divided into two parts. One part is completely grounded with copper metal. Another part is placed with metamaterial substrates. The dimension of ground part is 20.2 × 31.6 mm. The unit cell is has dimension of 3.6 mm square. There are rectangular cut of dimension 0.3 × 0.8 mm. These cutes are ported on each side of the square cell. The value of impedance bandwidth is from basically 3GHz to more than the 14 GHz. Maximum gain we noticed from fractal antenna is 15.8533db.

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基于星形分形天线的超材料设计与仿真

本文提出了一种用于超宽带应用的简单的基于超材料的紧凑微带天线。正在选择尺寸为36 ×36 mm的patch。通过零迭代最小化贴片天线的谐振频率，使其与中心辐射的贴片分别保持不变。我们将与第二次迭代进行比较。在这个特殊的设计中，恒星长度的尺寸是不同的，天线使用HFSS软件在3.45GHz工作。另一方面，为了在地面上做星形切割，给出0.3mm的星形天线。另一个地面设计有2mm的间隙到超材料。地面尺寸为20.6 × 31.6。我们工作中使用的基板材料是FR4。基材尺寸为45.4 × 31.6 × 1.6 mm。地面部分分为两部分。其中一部分用铜金属完全接地。另一部分放置有超材料基板。接地部分尺寸为20.2 × 31.6 mm。单晶胞的尺寸为3.6平方毫米。有尺寸为0.3 × 0.8 mm的矩形切割。这些图形被移植到方形单元格的每一边。阻抗带宽的值从基本3GHz到超过14ghz。分形天线的最大增益为15.8533db。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

2017 2nd IEEE International Conference on Recent Trends in Electronics, Information & Communication Technology (RTEICT)

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