An intercell busbar topology to improve resilience to anomalies of copper electrorefining process

Abstract

In copper electrorefining, the process anomalies have a great impact in the current efficiency and productivity. Short circuits produce nodules in copper cathodes, impaired contacts elevate the current density dispersion, and open contacts result in blank cathodes and over currents around the anomalies. This work presents an intercell topology composed by a busbar, a capping board and secondary connectors placed on top. Resilience to anomalies is improving by reducing the occurrence and fast recovery from outlasting anomalies. The addition of a secondary connector, the spatial arrangement and the light bulk mass of the connectors enlighten the location of the remaining anomalies in 1 minute. Finite element method modeling predicts the performance of the process innovation for Current Source and Voltage Source intercell busbars.