Big data analytic for multivariate fault detection and classification in semiconductor manufacturing

Ying-Jen Chen, Bo-Cheng Wang, Jei-Zheng Wu, Yi-Chia Wu, Chen-Fu Chien
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引用次数: 5

Abstract

Nowadays, there are more attentions on cost control and yield enhancement in the semiconductor industry. Many manufacturers have the ability to collect the physical data called Status Variables Identification (SVID) by sensors embedded in the advanced machines during the manufacturing process. To maintain the competitive advantages, process monitoring and quick response to yield problem are pivotal in detecting the cause of the faults with the help of the sensor data. To state the physical nature of certain SVID, we usually transform SVID into Fault Detection and Classification parameters (FDC parameters) using statistical indicators. The data containing FDC parameters is called FDC data. This study aims to develop a multivariate analysis model to find out the crucial factors which may lead to process excursion among a large amount of FDC data. We proposed a 2-phase multivariate analysis framework: (1) the Least Absolute Shrinkage and Selection Operator (LASSO) is applied for key operation screening. (2) And Random Forest (RF) is used to rank the FDC parameters based on the key operations. Based on the results, domain engineers can quickly take actions responding to low yield problems.
半导体制造中多变量故障检测与分类的大数据分析
目前,半导体行业越来越重视成本控制和良率的提高。许多制造商有能力在制造过程中通过嵌入在先进机器中的传感器收集称为状态变量识别(SVID)的物理数据。为了保持竞争优势,过程监控和对良率问题的快速响应是利用传感器数据检测故障原因的关键。为了说明某个SVID的物理性质,我们通常使用统计指标将SVID转化为故障检测与分类参数(FDC参数)。包含FDC参数的数据称为FDC数据。本研究旨在建立多元分析模型,从大量的FDC数据中找出可能导致过程偏移的关键因素。我们提出了一个两阶段的多变量分析框架:(1)采用最小绝对收缩和选择算子(LASSO)进行关键操作筛选。(2)使用随机森林(Random Forest, RF)对FDC参数根据关键操作进行排序。基于结果,领域工程师可以快速采取行动响应低良率问题。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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