Reconstituted Wafer Technology for Heterogeneous Integration

Abstract

This paper reports a novel method for heterogeneous integration by re-embedding diced chips into a carrier wafer. We rely on capillary forces to register embedded chips to their carrier with sub-micron accuracy, as well as on a novel sedimentation method to solidly seal the chips into the carrier. By creating a CMOS-clean reconstituted wafer ready for subsequent process steps, this approach enables the integration of technologies that were originally incompatible in terms of substrate material, substrate size, and/or thermal budget, while retaining the benefits of batch processing.