The development of the package of the Terahertz integrated circuits

Abstract

This paper attempts to give an overview about the packaging technologies of terahertz monolithic integrated circuits (TMIC) applied to the radar and imaging field for the last few decades. The recent progress of common packaging techniques including metallic waveguide package, low temperature co-fired ceramic and micro-machining technology are introduced to solve challenges of packaging technologies. Furthermore, detailed reports about the metallic split blocks with rectangular waveguide are carried on for its advanced processing technology, great compatibility of flanged connection system and low insertion loss. At last, three package methods about waveguide packaging, namely radial E-plane probes, dipole antenna transitions and flipchip interconnects for terahertz modules are illustrated based on the latest developments.