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Redesign Sanjai Chips Packaging Using Kansei Engineering Method

International Journal of Information Engineering and Electronic Business Pub Date : 2022-12-08 DOI:10.5815/ijieeb.2022.06.04
Meylia Vivi Putri, Isdaryanto Iskandar, Andhika
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International Journal of Information Engineering and Electronic Business
International Journal of Information Engineering and Electronic Business
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