Comparison of IGCT and IGBT for the use in the modular multilevel converter for HVDC applications

M. Buschendorf, J. Weber, S. Bernet
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引用次数: 46

Abstract

This paper describes briefly the modeling of the modular multilevel converter, which was introduced by Rainer Marquardt [1]. The mathematical model is used to calculate the average losses and junction temperature of the semiconductor devices in dependence on the converter output power. The junction temperature, the semiconductor losses and their several components are shown in order to compare a converter with IGCTs and a converter with IGBTs as switches. The comparison is made to show in which operating point the one or the other has its advantages.
高压直流应用中模块化多电平变换器中IGCT和IGBT的比较
本文简要介绍了Rainer Marquardt[1]提出的模块化多电平变换器的建模方法。利用数学模型计算了半导体器件的平均损耗和结温随变换器输出功率的变化规律。结温,半导体损耗和它们的几个组成部分显示,以便比较与igct转换器和转换与igbt作为开关。通过比较,可以看出两者在哪个工作点上有各自的优点。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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