The Path Forward for GaN Power Devices

A. Lidow
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引用次数: 8

Abstract

GaN power devices, discrete transistors and integrated circuits, have been in production for over 10 years and have made significant inroads in many applications that benefit from the smaller size and the faster switching speed. These devices are several times smaller than their aging silicon MOSFET ancestors and, largely because of this size advantage, have also become comparatively less costly to produce. In this paper we will discuss cost, power density, and integration challenges facing GaN producers. We will attempt to quantify the impact and set a reasonable timetable for implementation.
GaN功率器件的发展方向
GaN功率器件,分立晶体管和集成电路,已经生产了10多年,并在许多应用中取得了重大进展,这些应用受益于更小的尺寸和更快的开关速度。这些器件比其老化的硅MOSFET祖先小几倍,主要是因为这种尺寸优势,生产成本也相对较低。在本文中,我们将讨论GaN生产商面临的成本、功率密度和集成挑战。我们将尝试量化影响,并制定合理的实施时间表。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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