{"title":"Encapsulation processes for magnetic components and their effect on component functionality","authors":"H. Arris","doi":"10.1109/EEIC.2001.965603","DOIUrl":null,"url":null,"abstract":"Sandia National Laboratories has been encapsulating magnetic components for over 40 years. The design of magnetic component assemblies that must withstand a variety of environments and then function correctly is dependent on the appropriate use of encapsulating formulations. Specially developed material processing parameters are often critical in the encapsulation process and enable us to provide high reliability magnetic components. This paper discusses encapsulation process parameters for several of our formulations utilized for magnetic components. Process deviations that affect component functionality are also discussed.","PeriodicalId":228071,"journal":{"name":"Proceedings: Electrical Insulation Conference and Electrical Manufacturing and Coil Winding Conference (Cat. No.01CH37264)","volume":"13 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2001-10-16","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"2","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"Proceedings: Electrical Insulation Conference and Electrical Manufacturing and Coil Winding Conference (Cat. No.01CH37264)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1109/EEIC.2001.965603","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 2
Abstract
Sandia National Laboratories has been encapsulating magnetic components for over 40 years. The design of magnetic component assemblies that must withstand a variety of environments and then function correctly is dependent on the appropriate use of encapsulating formulations. Specially developed material processing parameters are often critical in the encapsulation process and enable us to provide high reliability magnetic components. This paper discusses encapsulation process parameters for several of our formulations utilized for magnetic components. Process deviations that affect component functionality are also discussed.