Scalpel soft retrace scanning spreading resistance microscopy for 3D-carrier profiling in sub-10nm WFIN FinFET

P. Eyben, T. Chiarella, S. Kubicek, H. Bender, O. Richard, J. Mitard, A. Mocuta, N. Horiguchi, A. Thean
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引用次数: 4

Abstract

Site-specific real three-dimensional (3D) carrier profiling in sub-10nm WFIN devices is demonstrated for the first time. Extension-gate overlap, active dopant concentration and distribution inside extensions and epi source/drain are observed with 1 nm-spatial resolution along X, Y and Z-directions. Using this new technique providing full 3D-carrier mapping we analyzed different processing flows for sub-10nm fin width FinFETs, identified possible failure mechanisms, and demonstrated the direct link between improved performance and 3D-carrier distribution at the nm-scale.
用于亚10nm WFIN FinFET中3d载流子分析的手术刀软回迹扫描扩展电阻显微镜
首次在10nm以下WFIN器件中展示了特定位点的真实三维(3D)载流子分析。以1nm的空间分辨率沿X、Y和z方向观察延伸栅重叠、延伸栅内活性掺杂浓度和分布以及外延源/漏极。利用这种提供完整3d载流子映射的新技术,我们分析了10nm以下鳍宽finfet的不同处理流程,确定了可能的失效机制,并证明了在纳米尺度上改进性能与3d载流子分布之间的直接联系。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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