Properties of nano-composite SACX0307-(ZnO, TiO2) solders

2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC) Pub Date : 2021-09-13 DOI:10.23919/empc53418.2021.9585015

B. Illés, A. Skwarek, O. Krammer, T. Hurtony, Dániel Straubinger, J. Ratajczak, G. Harsányi, K. Witek

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Abstract

In the present study, SACX0307-ZnO and SACX0307-TiO2 nano-composite solder pastes were fabricated. The ceramic reinforcements were used in 1wt% and with different primary particle sizes between 50-200nm. The soldering properties and microstructure of the solder joints were investigated. The nano-particles were mixed into the solder paste by standard ball milling process. Reflow soldering technology has been applied to prepare solder joints and spreading tests from the different solder alloys. The solder joints were evaluated by shear test, and cross-sections were prepared to investigate the metallographic properties by Scanning Electron Microscopy (SEM). The different ceramic nano-particles had different effects on the solderability of solder alloys. Best results were observed in the case of TiO2 nano-particles with improved wetting and mechanical strength. The microstructural investigations showed considerable grain refinement and the modified grain boundary/interfacial properties, which could cause the increase of the mechanical parameters.

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纳米复合SACX0307-(ZnO, TiO2)钎料的性能

本研究制备了SACX0307-ZnO和SACX0307-TiO2纳米复合锡膏。陶瓷增强剂用量为1wt%，初始粒径在50 ~ 200nm之间。研究了焊点的焊接性能和显微组织。采用标准的球磨工艺将纳米颗粒混合到锡膏中。回流焊技术已应用于不同钎料合金的焊点制备和铺焊试验。通过剪切试验对焊点进行了评价，并制备了焊点截面，通过扫描电子显微镜(SEM)研究了焊点的金相性能。不同的纳米陶瓷颗粒对钎料合金的可焊性有不同的影响。TiO2纳米颗粒的润湿性和机械强度均有改善，效果最好。显微组织研究表明，合金的晶粒细化和晶界/界面性能发生了明显的改变，这可能导致力学参数的增加。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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来源期刊

2021 23rd European Microelectronics and Packaging Conference & Exhibition (EMPC)

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