Integrated Optical Circuits Utilizing Surface Mount Photonics Technology

Abstract

In this paper, the surface mount photonics (SMP) approach to optical components is described. SMP adopts many elements of silicon component manufacturing. Key elements of SMP include the use of CMOS foundries for planar lightwave circuit (PLC) fabrication, wafer scale testing of active III-V devices, flip chip bonding of devices using passive alignment, and the use of low cost non-hermetic plastic packaging