{"title":"2-Dimentional Fiber Array with Reflow Compatibility for High-Density Optical Interconnection","authors":"T. Kumagai, H. Arao, H. Nguyen, T. Nakanishi","doi":"10.1364/ofc.2020.w2a.3","DOIUrl":null,"url":null,"abstract":"We developed a 2-dimensional fiber array (2D-FA) as an optical interconnection device for co-packaged optics. The 2D-FA was capable of maintaining a low connection loss of < 1.0 dB after reflow process at 260°C.","PeriodicalId":173355,"journal":{"name":"2020 Optical Fiber Communications Conference and Exhibition (OFC)","volume":"17 1","pages":"0"},"PeriodicalIF":0.0000,"publicationDate":"2020-03-01","publicationTypes":"Journal Article","fieldsOfStudy":null,"isOpenAccess":false,"openAccessPdf":"","citationCount":"0","resultStr":null,"platform":"Semanticscholar","paperid":null,"PeriodicalName":"2020 Optical Fiber Communications Conference and Exhibition (OFC)","FirstCategoryId":"1085","ListUrlMain":"https://doi.org/10.1364/ofc.2020.w2a.3","RegionNum":0,"RegionCategory":null,"ArticlePicture":[],"TitleCN":null,"AbstractTextCN":null,"PMCID":null,"EPubDate":"","PubModel":"","JCR":"","JCRName":"","Score":null,"Total":0}
引用次数: 0
Abstract
We developed a 2-dimensional fiber array (2D-FA) as an optical interconnection device for co-packaged optics. The 2D-FA was capable of maintaining a low connection loss of < 1.0 dB after reflow process at 260°C.