Fabrication and thermal stability characterization of Ru electrode used for high power contact RF MEMS switch

Abstract

This paper presents the fabrication and thermal stability of the Ru electrode used for high power Ru-Au contact RF MEMS switch with microspring contact design. Here we develop a new process with bilayer lift-off and strain release layer to get the 3000 Å Ti/Au/Ru electrode with excellent smooth edge for high power handling and low loss. Furthermore, the thermal test at 400°C , 500°C and 600°C over 1 hour has been done. Investigation of the surface with SEM and EDX shows that the electrode has a good thermal stability at 400°C, which is proper for high power handling.