Convex optimization of wafer temperature trajectories for rapid thermal processing

P. Gyugyi, Y. Cho, G. Franklin, T. Kailath
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引用次数: 5

Abstract

In this paper, we expand on the framework for achieving the tight control of the wafer temperature essential in rapid thermal processing (RTP) of semiconductor wafers. In our previous paper (1992), we established a method for identifying a state-space model of an RTP system at a processing condition of interest and designing a linear quadratic Gaussian (LQG) controller for disturbance regulation. In this paper we describe how convex optimization is used to obtain an approximation to the desired trajectory, close enough to allow high gain feedback controllers to reduce temperature nonuniformity. Temperature errors less than 30/spl deg/C peak-to-peak, limited almost entirely by our system geometry, were achieved throughout a typical wafer recipe, which included ramps from room temperature to 900/spl deg/C and from 900/spl deg/C to 600/spl deg/C, at the rate of 40/spl deg/C per second. The benefits of convex optimization together with the LQG feedback control are demonstrated by experimental results obtained from an RTP system.<>
快速热加工晶圆温度轨迹的凸优化
在本文中,我们扩展了在半导体晶圆的快速热处理(RTP)中实现晶圆温度严格控制的框架。在我们之前的论文(1992)中,我们建立了一种方法来识别RTP系统在感兴趣的处理条件下的状态空间模型,并设计了一个线性二次高斯(LQG)控制器来调节干扰。在本文中,我们描述了如何使用凸优化来获得所需轨迹的近似值,足够接近以允许高增益反馈控制器减少温度不均匀性。在一个典型的晶圆配方中,以每秒40/spl°C的速率,从室温到900/spl°C和从900/spl°C到600/spl°C,峰对峰的温度误差小于30/spl°C,几乎完全受我们系统几何形状的限制。通过RTP系统的实验结果,证明了凸优化与LQG反馈控制相结合的优越性。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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