Area-Per-Yield and Defect Level of Cascaded TMR for Pipelined Processors

M. Arai, K. Iwasaki
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引用次数: 1

Abstract

In this paper we evaluate the effectiveness of cascaded triple modular redundancy (TMR) in terms of area-per-yield and defect level by applying to every stage of a pipelined processor. Considering a cascade of nine possible TMR stage architectures, we theoretically derive the area-per-yield on the basis of the given parameters of defect density and the number of stages. Also, assuming that a production test is independently applied for each module and voter in every stage and the pass/fail of a chip is determined on the basis of the test result, we theoretically derive the defect level for the given fault coverage. Numerical examples show that the application of cascaded TMR improves the area-per-yield and the defect level when manufacturing yield is low. In addition, some cases exist in which the number of stages minimize the area-per-yield or the defect level.
流水线处理器级联TMR的单产面积和缺陷水平
本文将级联三模冗余(TMR)应用于流水线处理器的各个阶段,从成品率和缺陷水平两方面评价了其有效性。考虑到9个可能的TMR级结构的级联,我们在给定缺陷密度和级数参数的基础上,从理论上推导出了单产面积。另外,假设在每个阶段对每个模块和投票人进行独立的生产测试,并且根据测试结果确定芯片的通过/失败,我们理论上推导出给定故障覆盖率的缺陷级别。数值算例表明,在制造良率较低的情况下,级联TMR的应用提高了单产面积和缺陷水平。此外,在某些情况下,阶段的数量会最小化每产量的面积或缺陷水平。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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