Disturbed bonding states in SiO/sub 2/ thin-films and their impact on time-dependent dielectric breakdown

J. McPherson, H. Mogul
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引用次数: 55

Abstract

A temperature-independent field acceleration parameter /spl gamma/ and a field-independent activation energy /spl Delta/Ho can result when different types of disturbed bonding states are mixed during time-dependent dielectric breakdown (TDDB) testing of SiO/sub 2/ thin films. While /spl gamma/ for each defect type alone has the expected 1/T dependence and /spl Delta/Ho shows a linear decrease with electric field, a nearly temperature-independent /spl gamma/ and a field-independent /spl Delta/Ho can result when two or more disturbed bonding states are mixed. These observations suggest strongly that the oxygen vacancy is an important intrinsic defect for breakdown and that field, not current, is the cause of TDDB under low-field conditions.
SiO/sub /薄膜中受干扰的键合状态及其对介电击穿的影响
在SiO/sub /薄膜的时间相关介电击穿(TDDB)测试中,当混合不同类型的干扰键态时,可以得到与温度无关的场加速参数/spl gamma/和与场无关的活化能/spl Delta/Ho。虽然每种缺陷类型的/spl gamma/都具有预期的1/T依赖性,/spl Delta/Ho随电场呈线性下降,但当两种或两种以上的干扰键态混合时,会产生几乎与温度无关的/spl gamma/和与场无关的/spl Delta/Ho。这些观察结果有力地表明,氧空位是击穿的一个重要内在缺陷,在低场条件下,场而不是电流是TDDB的原因。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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