A new lumped model for on-chip inductors including substrate currents

A. Savio, M. Carmina, A. Richelli, L. Colalongo, Z. Kovács-Vajna
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引用次数: 7

Abstract

A new lumped model for on-chip planar (square, hexagonal, octagonal) inductors is presented. The model is simple, it is based on linear passive components with frequency independent parameters and accurately accounts for the substrate leakage currents in a wide frequency range. Furthermore, the model is straightforwardly implementable in circuit simulators such as, for example, SPICE.
包含衬底电流的片上电感器新集总模型
提出了一种新的片上平面(方形、六角形、八角形)电感的集总模型。该模型简单,基于具有频率无关参数的线性无源元件,能在较宽的频率范围内准确地计算基片泄漏电流。此外,该模型可以直接在电路模拟器中实现,例如SPICE。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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