Poled polymer integrated photonic interconnect networks for electronic systems

Abstract

Using straightforward extensions of semiconductor fabrication processes, multilayer structures of electrooptic (EO) polymers can be fabricated in large-area formats with high device packing densities. Furthermore, polymer EO devices can be fabricated directly on electronic substrates and assembled with IC's to permit true integration of photonics and electronics in a single highly compact and efficient package. Those applications that require very high levels of integration, high bandwidths, and hybrid assembly of photonic and electronic devices are described. The current status of the technology is illustrated by integrated optic devices based on EO polymer materials, notably a waveguide electrical-to-optical transmitter with a CMOS level drive integrated with an optical waveguide channel. Highly integrated structures, in which electronic and photonic functions operate in close proximity, place severe requirements on all materials parameters, and particularly on the thermal stability of the EO state of the polymer material. The materials requirements that have been derived for such systems are reviewed. One approach to achieving materials with the required stability is described.<>