Development of the base technology for surface multichipping modules on the multilayer polyimide boards having the increased mounting density of the add-on components and using modification 2 chip ic in order to organize production of the microelectronic hubrid functional assemblies

Abstract

LSI's without any packge on the polyimide substrate are a perspective version of the general MCM construction, because they not only increase use efficiency of the commutation board, but allow to realize high element speed by refuse from traditional package and lead frame.