PVT-variation based Comparative Analysis of Write Driver Designs for SRAM at 32 nm

Monica Gupta, Manisha, R. Jha, Ruchika Kumari, Ankit Singh
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Abstract

In this paper, the existing write driver designs for SRAM are analyzed at 32 nm technology node. The performance of the designs are compared on the basis of Write Delay, Write Power consumption, Energy per Switching activity and Complexity of the design. The simulations are also done under PVT-variations to observe the impact of different operating conditions on the performance of the design. From the results, it is observed that the NOR gate based design performs fastest write operation with up to 9 % improvement in Write Delay. The Pass gate based design consumes least Write Power and Energy per Switching activity with up to 55.9 % and 51.5 % reduction respectively at TT corner, 1.1 V, 27 °C. In addition, the results show that the Write Delay of all the designs suffer at SF corner, low supply voltage and low temperatures. Alternatively, the designs perform faster write operation at FS corner, high supply voltages and high temperatures. The Write Power consumption is minimum at SS corner, low supply voltages and high temperatures and maximum at FF corner, high supply voltages and high temperatures. The Energy consumed per Switching activity is least at SS corner, low supply voltages and high temperatures.
基于pvt变化的32nm SRAM写入驱动设计比较分析
本文分析了现有的32nm节点SRAM写入驱动设计。从写时延、写功耗、每开关活动能量和设计复杂度等方面比较了两种设计的性能。在pvt变化条件下进行仿真,观察不同工况对设计性能的影响。从结果中可以看出,基于NOR门的设计执行最快的写操作,写延迟提高了9%。在TT角,1.1 V, 27°C时,基于通栅极的设计消耗的每个开关活动的写功率和能量分别降低55.9%和51.5%。此外,在SF角、低电源电压和低温条件下,所有设计的写入延迟都受到影响。另外,该设计在FS角、高电源电压和高温下执行更快的写入操作。写功耗在SS角、低电压和高温时最小,在FF角、高电压和高温时最大。在SS角、低电压和高温条件下,每开关活动所消耗的能量最少。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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