Lead-free Assembly Defects in Plastic Ball Grid Array Packages

Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics Pub Date : 2005-10-23 DOI:10.1109/POLYTR.2005.1596523

S. Ganesan, Geunwoo Kim, Ji Wu, M. Pecht, J. Felba

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引用次数: 6

Abstract

Printed circuit boards were assembled at Jabil's San Jose facility using their qualified surface mount assembly processes. The assembly involved lead-free plastic ball grid array (PBGA) packages (256 I/O) soldered to FR4 and polyimide printed circuit boards. The maximum peak lead-free reflow temperature measured at a PBGA location was 246°C. After the lead-free reflow, the assemblies exhibited solder joint defects. The three defect modes were bridges, oversized solder joints, and insufficient solder joints; in some cases these all occurred within a single PBGA. This was not expected because the PBGAs were rated as moisture sensitivity level 3 (MSL 3) and the floor life restrictions were followed as per JEDEC 020C. This paper discusses the details of the defect phenomenon and the failure analysis, and also proposes the failure mechanism based on modeling and materials characterization data. Based on this study, recommendations are provided to prevent the occurrence of the assembly defects.

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塑料球栅阵列封装中的无铅组装缺陷

印刷电路板在Jabil的圣何塞工厂使用其合格的表面贴装组装工艺组装。组装涉及无铅塑料球栅阵列(PBGA)封装(256 I/O)焊接到FR4和聚酰亚胺印刷电路板。在PBGA位置测得的无铅回流温度最高峰值为246℃。无铅回流后，组件出现焊点缺陷。三种缺陷模式分别为桥接、超大焊点和不足焊点;在某些情况下，这些都发生在一个PBGA内。这是意料之外的，因为PBGAs被评为3级湿敏感性(MSL 3)，并且地板寿命限制遵循JEDEC 020C。本文详细讨论了缺陷现象和失效分析，并提出了基于模型和材料表征数据的失效机理。在此基础上，提出了防止装配缺陷发生的建议。

本文章由计算机程序翻译，如有差异，请以英文原文为准。

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Polytronic 2005 - 5th International Conference on Polymers and Adhesives in Microelectronics and Photonics

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