Identification and rapid screen based on immune sensor

Ching-Jui Shih, Nai-Hao Kuo, Hung-Hsin Tsai, Wei-Chih Lin, C. Lieu
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引用次数: 1

Abstract

The object of this paper is that the immobilization technology for antibodies onto silicon-based chip. The active site of an IgG, the paratope, in many cases does not interact with the solid matrix and is, therefore, available for antibody-antigen complex formation. Due to △S > 0, the spontaneity activation of the Sulfur-Au bond is successfully forming and the target protein binding region was chemically modified to introduce aldehyde group. We also demonstrated the more linkers, the more antibodies onto the surface. And than we use fluorescence substrate, Rodamine, conjugate the antibodies in order to observe the amount of antiboies. In our studies, we also demanded that our methodology is still good to antibodies immobilization without any impair the antibodies. Although there is still non-specific binding of Ab on the modify chip, we can observe the antibodies (Green flourescence) on the measure of areas which is the metal, Au deposited on modify chip.
基于免疫传感器的识别与快速筛选
本文的目的是研究抗体在硅片上的固定化技术。在许多情况下,IgG的活性位点,即伞盖,不与固体基质相互作用,因此可用于抗体-抗原复合物的形成。由于△S > 0,硫金键自发活化成功形成,靶蛋白结合区被化学修饰引入醛基。我们还证明了连接体越多,表面上的抗体就越多。然后我们用荧光底物罗丹明将抗体偶联以观察抗体的数量。在我们的研究中,我们还要求我们的方法在不损害抗体的情况下仍能很好地固定抗体。虽然修饰芯片上仍存在Ab的非特异性结合,但在修饰芯片上沉积金属Au的测量区域上可以观察到抗体(绿色荧光)。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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