Enabling chip, package and PCB system co design and analysis in a heterogeneous integration environment - An EDA approach

Abstract

A holistic system design approach is presented in this work which helps co-design and analyse a multi technology array of ICs, packages and PCBs. The proposed methodology provides the key functionality to simulate and thus co design an IC in context of its PCB and package parasitic models, at the same time, staying within the IC designers preferred design and simulation environment requiring minimal knowledge of packaging and PCB design techniques. It is, primarily, an IC centric co design environment and a simulation solution that allows the analog, RF, and mixed-signal designers to drive designs of package modules to their packaging teams and define simulation testbenches that include the native IC and its corresponding package, and PCB interconnect and component level parasitic models prior to tape-out. The breadth of this “one-ocean” solution caters equally to a wide array of applications including mm-wave RF, power management ICs and low power analog front ends.