Novel superjunction LDMOS with multi-floating buried layers

Zhen Cao, B. Duan, Song Yuan, Haijun Guo, Jianmei Lv, Tongtong Shi, Yintang Yang
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引用次数: 11

Abstract

In this paper, a novel superjunction lateral double-diffused MOSFET (SJ-LDMOS) based on the bulk electric field modulation is proposed. The new structure is characterized by adding the multiple floating buried layers (MFBL) into the substrate/epitaxial layer. In this way, the high bulk electric field under the drain diffusion edge is reduced and the overall bulk electric field distribution is optimized. In addition, the N+/P-substrate junction and the auxiliary MFBL/substrate junctions jointly sustain a high breakdown voltage (BV). Simulated results show that the BV of MFBL SJ-LDMOS is improved by about 80.4% than that of the buffered step doping (BSD) SJ-LDMOS with the same drift region length. Furthermore, compared with the N-type buffered SJ-LDMOS the BV of MFBL SJ-LDMOS significantly increases by 131.7%. Moreover, the power figure-of-merit (FOM=BV2/RON, sp) of MFBL SJ-LDMOS reaches 13.07 MW/cm2 with the excellent performance breaking the silicon limit.
新型多浮埋层超结LDMOS
本文提出了一种基于体电场调制的新型超结横向双扩散MOSFET (SJ-LDMOS)。新结构的特点是在衬底/外延层中添加了多个浮动埋层(MFBL)。这样可以减小漏极扩散边下的高体电场,优化整体体电场分布。此外,N+/ p衬底结和辅助MFBL/衬底结共同维持高击穿电压(BV)。仿真结果表明,在相同的漂移区长度下,MFBL SJ-LDMOS的BV比缓冲阶跃掺杂(BSD) SJ-LDMOS的BV提高了约80.4%。与n型缓冲SJ-LDMOS相比,MFBL SJ-LDMOS的BV显著提高了131.7%。此外,MFBL SJ-LDMOS的功率优值(FOM=BV2/RON, sp)达到13.07 MW/cm2,其优异的性能突破了硅的极限。
本文章由计算机程序翻译,如有差异,请以英文原文为准。
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