ESD latency effects in CMOS integrated circuits

Abstract

Measurements were performed on two types of commercially available and custom-made CMOS integrated circuits to investigate the latent mode of failure due to ESD (electrostatic discharge). The current injection test method is used for both polarities of discharge. Test parameters studied include threshold failure, constant amplitude multiple stress, step stress, and the stress hardening effect. Statistical analyses of the results demonstrate the presence of latent failure in CMOS integrated circuits due to ESD. The work is used to further expand a charge injection model for latent failures.<>